1M983800

Nano Devices and Materials

Nano Devices and Materials

開講部

大学院理工学研究科　修士課程

開講学科

電気電子情報工学専攻

開講学年

1年次

開講時期

後期

単位数

2

単位区分

特修

系列区分

特論

講義区分

講義
教授上野和良

科目英語名称

Nano Devices and Materials

授業内容

In this course, students will study topics in advanced interconnect technology through reading recent papers. The students will make presentations based on the papers. Through making the presentation, students will learn not only the technical and scientific knowledge but also how to organize the technical study. The topics will include advanced copper interconnects, copper grain growth, barrier metal processes, electroless plating, interconnect reliability, nano-carbon, optical interconnect, and so on.

授業計画

1．Course guidance
2．Review of advanced interconnect technology for large scale integrated circuit
3．Interconnect material, copper grain growth, copper resistivity
4．Interconnect metallization process(1) copper electroplating
5．Interconnect metallization process(2) electroless processes
6．Barrier metals and their processes
7．Interconnect reliability, electromigration, stress-induced voiding, time-dependent dielectric breakdown
8．Reliability enhancement processes, electroless metal capping, copper alloy
9．Nanocarbon, carbon nano-tube, graphen, and their application to interconnects
10．Optical interconnects, Ge photodetector, nano-photonics, surface plasmon anntena

評価方法と基準

Presentation performance: 50%
Report performance: 50%
Criteria for completion: 60%

教科書・参考書

Technical papers selected from recent international conference proceedings and technical journals.
Rainer Waser, "Nanoelectronics and Information Technology"Second corrected edition, Wiley-VCH, 2005.

環境との関連

環境関連科目 (環境教育割合 5%)
最終更新 : Sat Nov 26 15:44:26 JST 2011