Class schedule | HW assignments (Including preparation and review of the class.) | Amount of Time Required | |
---|---|---|---|
1. | Guidance | Application of Surface Treatment | 60minutes |
2. | Classification of Surface Treatment | Objective of Surface Treatment | 200minutes |
3. | Surface Treatment and Environmental Regulation | Use of Toxic Substances | 200minutes |
4. | Requisite Basic Technologies for Surface Treatment (1) Vacuum Technology | Vacuum Engineering | 200minutes |
5. | Requisite Basic Technologies for Surface Treatment (2) Plasma | Plasma Science | 200minutes |
6. | Requisite Basic Technologies for Surface Treatment (3) Electromagnetic Ray | Electromagnetics | 200minutes |
7. | Dry Process(1) Vacuum Vapor Deposition and Sputtering | Vacuum Vapor Deposition | 200minutes |
8. | Dry Process(2) Ion Plating and Ion Implantation | Gaseous Reaction Chemical | 200minutes |
9. | Dry Process(3) CVD(Chemical Vapor Deposition) | Plasma | 200minutes |
10. | Dry Process(4) Heat Treatment and Thermal Spray | High Temperature Reaction | 200minutes |
11. | Wet Process(1) Electroplating | Electrochemistry | 200minutes |
12. | Wet Process(2) Electroless Plating | Displacement Reaction | 200minutes |
13. | Wet Process(3) Anodic Oxidation and Conversion Treatment Application of Surface Treatment(Topics) |
Oxide film Application of Surface Treatment |
200minutes |
14. | Final Examination and Comments | All Review | 200minutes |
Total. | - | - | 2660minutes |
Attitude | Examination | Total. | |
---|---|---|---|
1. | 20% | 30% | 50% |
2. | 10% | 15% | 25% |
3. | 10% | 15% | 25% |
Total. | 40% | 60% | - |