| Class schedule | HW assignments (Including preparation and review of the class.) | Amount of Time Required | |
|---|---|---|---|
| 1. | Guidance | Application of Surface Treatment | 60minutes |
| 2. | Classification of Surface Treatment | Objective of Surface Treatment | 200minutes |
| 3. | Surface Treatment and Environmental Regulation | Use of Toxic Substances | 200minutes |
| 4. | Requisite Basic Technologies for Surface Treatment (1) Vacuum Technology | Vacuum Engineering | 200minutes |
| 5. | Requisite Basic Technologies for Surface Treatment (2) Plasma | Plasma Science | 200minutes |
| 6. | Requisite Basic Technologies for Surface Treatment (3) Electromagnetic Ray | Electromagnetics | 200minutes |
| 7. | Dry Process(1) Vacuum Vapor Deposition and Sputtering | Vacuum Vapor Deposition | 200minutes |
| 8. | Dry Process(2) Ion Plating and Ion Implantation | Gaseous Reaction Chemical | 200minutes |
| 9. | Dry Process(3) CVD(Chemical Vapor Deposition) | Plasma | 200minutes |
| 10. | Dry Process(4) Heat Treatment and Thermal Spray | High Temperature Reaction | 200minutes |
| 11. | Wet Process(1) Electroplating | Electrochemistry | 200minutes |
| 12. | Wet Process(2) Electroless Plating | Displacement Reaction | 200minutes |
| 13. | Wet Process(3) Anodic Oxidation and Conversion Treatment Application of Surface Treatment(Topics) |
Oxide film Application of Surface Treatment |
200minutes |
| 14. | Final Examination and Comments | All Review | 200minutes |
| Total. | - | - | 2660minutes |
| Attitude | Examination | Total. | |
|---|---|---|---|
| 1. | 20% | 30% | 50% |
| 2. | 10% | 15% | 25% |
| 3. | 10% | 15% | 25% |
| Total. | 40% | 60% | - |