The general approach adopted in most techniques of materials characterization is to explore the material with a beam of radiation
or high-energy particles, such as light, laser, X-rays, electrons, ions and neutrons. This course will give an overview and
the basic principles of the most popular materials characterization methods. The course will cover the following topics: Basic
principles, interaction of radiation and particle beams with matter. Diffraction methods and microscopy methods (optical,
electron microscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM)), tomography (atom-probe tomography
(APT), focused ion-beam milling (FIB)), microanalysis and spectroscopy, and thermal analysis techniques (DTA, DSC). The state-of-the-art
of the science of materialography will be discussed in detail.
The students will learn the basics of the advanced material characterization techniques using electron or ion beams, x-ray
techniques, thermal analysis techniques and can follow the recent developments in this field. Furthermore, the basic principles
of materialography will be outlined to teach the students to effectively prepare samples for advanced characterization.The
students will learn how to interpret at the measured results. At the end of the course, students should be able to make educated
decisions regarding the selection of appropriate characterization methods for a particular research problem.
| Goals and objectives | Course Outcomes | |
|---|---|---|
| 1. | The students will be able to understand the purpose of material characterization. |
A-1
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| 2. | The students will be able to understand the basic physics of the advanced material characterization techniques |
A-1
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| 3. | The students will be able to show a knowledge of the capabilities and limitations of the different types of analysis introduced in the course |
A-1
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| 4. | The students will be able to make educated decisions regarding the selection of appropriate characterization methods for a particular research problem |
A-1
|
| Class schedule | HW assignments (Including preparation and review of the class.) | Amount of Time Required | |
|---|---|---|---|
| 1. | Introduction to the course: Relevance of advanced characterization to materials development, Overview of various characterization techniques |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 2. | Basic principles of material characterization Optical characterization techniques |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 3. | Interaction of radiation and particle beams with matter X-ray diffraction analysis (XRD) Introduction to X-Ray Powder Diffraction Data Analysis |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 4. | Electron microscopy I: SEM Principle and application of Scanning Electron Microscopy (SEM); |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 5. | Electron microscopy II: Chemical analysis by X-ray analysis in electron microscopes (EDS and WDS) Electron Backscatter Diffraction (EBSD)/Orientation Imaging Microscopy (OIM) |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 6. | Electron microscopy III: Principle and application of Transmission Electron Microscopy (TEM) |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 7. | Midterm exam and discussion of the results | Preparation for midterm | 200分 |
| 8. | Surface preparation techniques: basic methods of materialographic preparation | Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 9. | Observation and evaluation of the microstructure (imaging techniques: optical microscopy; SEM, TEM) of metallic and ceramic materials or composites | Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 10. | Tomography techniques I: Focused Ion Beam (FIB) - principle and application |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 11. | Tomography techniques II: Atom Probe Tomography (APT) - principle and application |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 12. | Microanalysis and spectroscopy: principle and application |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 13. | Thermal analysis techniques (DTA, DSC): principle and application |
Review of the lecture | 100分 |
| Home work preparation: Understanding contents of the lecture by reading distributed materials | 90分 | ||
| 14. | Final exam and discussion of the results | Preparation for final exam | 200分 |
| Total. | - | - | 2680分 |
| midterm exam | final exam | Total. | |
|---|---|---|---|
| 1. | 10% | 15% | 25% |
| 2. | 20% | 5% | 25% |
| 3. | 5% | 20% | 25% |
| 4. | 5% | 20% | 25% |
| Total. | 40% | 60% | - |
The students will be evaluated based on their:
midterm exam, activity during the class (presentation and discussion) will contribute 40% of the grade;
final exam will contribute 60% of the grade.
60% or more of the total score is needed for getting the course credit.
midterm exam, activity during the class (presentation and discussion) will contribute 40% of the grade;
final exam will contribute 60% of the grade.
60% or more of the total score is needed for getting the course credit.
| ways of feedback | specific contents about "Other" |
|---|---|
| Feedback in outside of the class (ScombZ, mail, etc.) |
1.Materials Characterization Techniques, bySam Zhang, Lin Li, Ashok Kumar;
CRC Press, Published December 22, 2008; ISBN 9781420042948
Scientific materials (publications), related to the lecture will be used as references
2. R. F. Egerton, Physical Principles of Electron Microscopy, Springer 2016, ISBN 978-3-319-39876-1
3. P. W. Hawkes, J.C.H. Spence, Science of Microscopy, Springer 2007, ISBN 978-0-387-25296-4
4. Scientific materials (publications), related to the lecture will be used as references
CRC Press, Published December 22, 2008; ISBN 9781420042948
Scientific materials (publications), related to the lecture will be used as references
2. R. F. Egerton, Physical Principles of Electron Microscopy, Springer 2016, ISBN 978-3-319-39876-1
3. P. W. Hawkes, J.C.H. Spence, Science of Microscopy, Springer 2007, ISBN 978-0-387-25296-4
4. Scientific materials (publications), related to the lecture will be used as references
- Course that cultivates an ability for utilizing knowledge
- Course that cultivates a basic problem-solving skills
| Work experience | Work experience and relevance to the course content if applicable |
|---|---|
| N/A | N/A |
- 4.QUALITY EDUCATION
- 9.INDUSTRY, INNOVATION AND INFRASTRUCTURE
Last modified : Sat Sep 09 07:50:19 JST 2023